It's crucial to understand the basic principles of 8-Layer FPC Board in order to grasp its impact on the electronics industry. At its core, an China 8-Layer FPC Board is a flexible printed circuit board with eight conductive layers stacked within a flexible substrate. This multi-layer setup boosts the capabilities of traditional FPCs, enhancing the functionality and performance of electronic devices. The unmatched versatility and compact design of Customized 8-Layer FPC Board allow them to be integrated into various electronic applications, from consumer electronics to medical devices and aerospace systems.
As we wrap up the prototype stage, our main focus now is on manufacturing cheap 8-Layer FPC Board. We're taking the validated designs and turning them into production-ready flexible circuit boards,also offer . 8-Layer FPC Board free sample.The process involves a series of complex steps to ensure precise layer alignment, flawless electrical connections, and top-notch structural integrity – all essential for delivering reliable, high-performance electronic solutions.Low price 8-Layer FPC Board.
Basic information:
Item name: 8-Layer FPC Board
Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON
Layer: 8 Layers
Min.line width/space: 3mil/3mil(0.075mm/0.075mm)
Min.Hole size: 0.1mm(dirilling hole)
Max. Board size: 1200mm* 600mm
Finished board thickness: 0.2mm- 6.0mm
Copper foil thickness: 18um~280um(0.5oz~8oz)
NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm
Outline Tolerance: +/-0.13mm
Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK.
Impedance control tolerance: +/-10%
Remain thickness tolerance: +/-0.1mm
8-Layer FPC Board Typical finish types:
HASL: offers better solderability
LFHASL: provides better solderability
OSP: offers better solderability
IMM Ag: affords better solderability and Al (aluminum) wire bondable
IMM Sn: provides solderability
ENIG: offers solderability, Al wire bondable, and contact-surface
ENEPIG: better contact-surface, Al wire bondable, and solderability
Elec Au: is Al and Au (gold) wire bondable, better solderability and contact-surface
