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Item name: aluminum nitride ceramic PCB
Finished Product:Ceramic Circuit Board
Substrate Material:Aluminum Nitride (Aln) Ceramic
Surface Metallization Process:Mo-Mn Metallization and Ni Plating
Feature:Strong Bonding Strength Between Ceramic and Metal
Usage:to Realize Electrical Connections
Specification:Max. up to 140mm× 190mm
Transport Package:Individual Package
Ceramic circuit board has good high-frequency performance and electrical performance, and has high thermal conductivity, chemical stability and excellent thermal stability of organic substrates do not have the performance, is a new generation of large-scale integrated circuit and power electronic module of the ideal packaging material. In recent years, Silitong ceramic circuit boards have received extensive attention and rapid development.
