We have more COB FPCs in stock, this item also referred to as the printed circuit board in Chinese, is a vital electronic component that functions as the foundational support and electrical connectivity provider for other electronic components. Newest COB FPC technology involves the direct mounting of bare chips onto a printed circuit board, followed by lead bonding and protection with organic adhesive.This COB FPC are mostly used in the field of Industrial Control, Telecommunication, Automotive products,and so on.
The COB FPC process initiates with the application of a thermally conductive epoxy resin, typically infused with silver particles, to the designated wafer placement area on the substrate surface. Bulk cob fpc is acceptable.The wafer is then meticulously positioned directly onto the substrate and undergoes heat treatment until firmly secured. Subsequently, electrical connectivity between the silicon wafer and substrate is established through meticulous wire bonding. The exceptional service we offer our clients is the cornerstone of our success, and our mission has always remained unchanged: to deliver high quality cob pfc, cutting-edge products within our clients' specified time frames.
Basic information:
Item name: COB FPC
Min. Line Width:0.075um(3mil)
Min. Line Spacing:0.075um(3mil)
Surface Finishing:HASL lead free/ENIG
Board Size:6*6mm / 1250*500mm
Surface Finishing:HASL lead free/ENIG/OSP
Certificate:SGS/UL / ISO9001 / ISO14001 / RoHs / TS16949 / IPC-2
Solder mask color:Green / Red / Black / Blue / Yellow
PCB Assembly process:SMT / DIP / Assembly
Min solder mask thickness:10um
Max size of finish board:580*900mm
Rang of finish baords Thickness:0.41-7.2mm
Wrap and twist:+/- 5%
COB FOC Features:
1, suitable for SMD surface mounting technology to install wiring on the PCB circuit board.
2, suitable for high frequency use.
3, easy to operate, high reliability.
4, the ratio between the chip area and the package area is small.
